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374524B60023G

374524B60023G

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Boyd Laconia, LLC

HEAT SINK PASSIVE BGA/FPGA PIN ARRAY ANCHOR ALUMINUM BLACK ANODIZED

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374524B60023G

374524B60023G

Active
Boyd Laconia, LLC

HEAT SINK PASSIVE BGA/FPGA PIN ARRAY ANCHOR ALUMINUM BLACK ANODIZED

Find alt

Description

General part information

374524B60023G

HEAT SINK PASSIVE BGA/FPGA PIN ARRAY ANCHOR ALUMINUM BLACK ANODIZED

Technical Specifications

Parameters and characteristics for this part

Specification374524B60023G
Attachment MethodSolder Anchor
Fin Height0.984 in
Length1.063 in
MaterialAluminum
Material FinishBlack Anodized
Package CooledBGA
Power Dissipation1 W
ShapeSquare, Pin Fins
Thermal Resistance16.5 °C/W, 5.5 °C/W
TypeTop Mount
Width1.063 in

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