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TN0610N3-G - TO-92 / 3

TN0610N3-G

Active
Microchip Technology

MOSFET, N-CHANNEL ENHANCEMENT-MODE, 100V, 1.5 OHM 3 TO-92 BAG ROHS COMPLIANT: YES

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TN0610N3-G - TO-92 / 3

TN0610N3-G

Active
Microchip Technology

MOSFET, N-CHANNEL ENHANCEMENT-MODE, 100V, 1.5 OHM 3 TO-92 BAG ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTN0610N3-GTN0610 Series
Current - Continuous Drain (Id) @ 25°C-500 mA
Drain to Source Voltage (Vdss)-100 V
Drive Voltage (Max Rds On, Min Rds On)-3 - 10 V
FET Type-N-Channel
Input Capacitance (Ciss) (Max) @ Vds-150 pF
Mounting Type-Through Hole
null-
Operating Temperature--55 °C
Operating Temperature-150 °C
Package / Case-TO-226-3, TO-92-3
Power Dissipation (Max)-1 W
Supplier Device Package-TO-92-3
Technology-MOSFET (Metal Oxide)
Vgs (Max)-20 V
Vgs(th) (Max) @ Id-2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBag 1$ 1.28
25$ 1.06
100$ 0.98
Microchip DirectBAG 1$ 1.28
25$ 1.06
100$ 0.98
1000$ 0.80
5000$ 0.75
10000$ 0.69
NewarkEach 100$ 1.01

TN0610 Series

MOSFET, N-Channel Enhancement-Mode, 100V, 1.5 Ohm

PartCurrent - Continuous Drain (Id) @ 25°CDrain to Source Voltage (Vdss)FET TypePower Dissipation (Max)TechnologyPackage / CaseVgs (Max)Supplier Device PackageVgs(th) (Max) @ IdMounting TypeInput Capacitance (Ciss) (Max) @ VdsDrive Voltage (Max Rds On, Min Rds On)Operating Temperature [Min]Operating Temperature [Max]
Microchip Technology
TN0610N3-G-P003
500 mA
100 V
N-Channel
1 W
MOSFET (Metal Oxide)
TO-226-3, TO-92-3
20 V
TO-92-3
2 V
Through Hole
150 pF
3 V, 10 V
-55 °C
150 °C
Microchip Technology
TN0610N3-G
Microchip Technology
TN0610N3-G
500 mA
100 V
N-Channel
1 W
MOSFET (Metal Oxide)
TO-226-3, TO-92-3
20 V
TO-92-3
2 V
Through Hole
150 pF
3 V, 10 V
-55 °C
150 °C

Description

General part information

TN0610 Series

This low threshold, enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and well-proven, silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown.

Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.