Specification	SIP1X21-011B

Contact Finish - Mating	Gold
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Closed Frame
Grid Columns	21
Grid Rows	1
Housing Material	PPS, Glass Filled, Polyphenylene Sulfide
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	21
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Type	SIP

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