SMD4300SNL250T4
ActiveChip Quik Inc.
SLDR PST WATR SOL SAC305 T4 250G
SMD4300SNL250T4
ActiveChip Quik Inc.
SLDR PST WATR SOL SAC305 T4 250G
Description
General part information
SMD4300SNL250T4
SLDR PST WATR SOL SAC305 T4 250G
Technical Specifications
Parameters and characteristics for this part
| Specification | SMD4300SNL250T4 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Flux Type | Water Soluble, No-Clean |
| Form | Jar |
| Form Weight | 8.8 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Mesh Type | 4 |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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