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36-3551-10

36-3551-10

Active
Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

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36-3551-10

36-3551-10

Active
Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

Find alt

Description

General part information

36-3551-10

CONN IC DIP SOCKET ZIF 36POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification36-3551-10
Contact Finish - MatingTin
Contact Finish - PostTin
Contact Finish Thickness - Mating200 Ąin
Contact Finish Thickness - Post200 µin
Contact Material - MatingBeryllium Copper
Contact Material - PostBeryllium Copper
FeaturesClosed Frame
Grid Columns18
Grid Rows2
Housing MaterialPPS, Glass Filled, Polyphenylene Sulfide
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)36
Pitch - Mating0.1 in
Pitch - Post0.1 in
Row Spacing0.3 in
TerminationSolder
TypeZIF (ZIP), DIP, 0.3" (7.62mm) Row Spacing

Pricing

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CAD

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Documents

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