Specification	1354250

Ag Composition	3 %
Composition Elements	Cu, Sn, Ag
Composition Formula	Sn96.5Ag3Cu0.5
Cu Composition	0.5 %
Flux Type	Water Soluble
Form	Syringe
Form Weight	2.65 oz
Melting Point	423 °F
Process	Lead Free
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Sn Composition	96.5 %
Storage/Refrigeration Temperature (Maximum)	46.4 °F
Storage/Refrigeration Temperature (Minimum)	35.6 °F
Type	Solder Paste

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