Specification	FOLC-145-01-L-Q

Connector Type	Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Length - Post	0.075 in
Contact Material	Beryllium Copper
Contact Shape	Square
Contact Type	Female Socket
Current Rating (Per Contact)	2.6 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.18 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	180
Number of Positions Loaded	All
Number of Rows	4
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.05 in
Row Spacing - Mating	0.05 in
Style	Board
Termination	Solder

FOLC-145 Series

Part	Number of Positions	Number of Positions Loaded	Operating Temperature (Max)	Operating Temperature (Min)	Contact Length - Post	Fastening Type	Insulation Color	Insulation Height	Connector Type	Material Flammability Rating	Contact Type	Current Rating (Per Contact)	Number of Rows	Contact Finish Thickness - Mating	Termination	Contact Finish - Post	Style	Row Spacing - Mating	Features	Mounting Type	Pitch - Mating	Contact Finish - Mating	Insulation Material	Contact Material	Contact Shape
Samtec Inc. FOLC-145-01-L-Q-LC	180	All	125 °C	-55 °C	0.075 in	Push-Pull	Black	0.18 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	10 µin	Solder	Tin	Board	0.05 in	Board Lock	Through Hole	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-145-M1-S-Q	180	All	125 °C	-55 °C	0.075 in	Push-Pull	Black	0.185 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	30 µin	Solder	Tin	Board	0.05 in		Surface Mount Through Hole	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-145-04-S-Q-LC	180	All	125 °C	-55 °C	0.12 in	Push-Pull	Black	0.18 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	30 µin	Solder	Tin	Board	0.05 in	Board Lock	Through Hole	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-145-M1-L-Q	180	All	125 °C	-55 °C	0.075 in	Push-Pull	Black	0.185 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	10 µin	Solder	Tin	Board	0.05 in		Surface Mount Through Hole	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-145-04-L-Q	180	All	125 °C	-55 °C	0.12 in	Push-Pull	Black	0.18 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	10 µin	Solder	Tin	Board	0.05 in		Through Hole	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-145-01-S-Q-LC	180	All	125 °C	-55 °C	0.075 in	Push-Pull	Black	0.18 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	30 µin	Solder	Tin	Board	0.05 in	Board Lock	Through Hole	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-145-L4-S-Q	180	All	125 °C	-55 °C	0.12 in	Push-Pull	Black	0.18 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	30 µin	Solder	Tin	Board	0.05 in		Through Hole	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-145-02-S-Q-P-TR	180	All	125 °C	-55 °C		Push-Pull	Black	0.178 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	30 µin	Solder	Tin	Board	0.05 in	Pick and Place	Surface Mount	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-145-04-S-Q	180	All	125 °C	-55 °C	0.12 in	Push-Pull	Black	0.18 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	30 µin	Solder	Tin	Board	0.05 in		Through Hole	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-145-L4-S-Q-LC	180	All	125 °C	-55 °C	0.12 in	Push-Pull	Black	0.18 in	Receptacle	UL94 V-0	Female Socket	2.6 A	4	30 µin	Solder	Tin	Board	0.05 in	Board Lock	Through Hole	0.05 in	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square

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