IPC0184
ActiveChip Quik Inc.
POWERPAD-24/POWERSOIC-24 TO DIP-
IPC0184
ActiveChip Quik Inc.
POWERPAD-24/POWERSOIC-24 TO DIP-
Description
General part information
IPC0184
POWERPAD-24/POWERSOIC-24 TO DIP-
Technical Specifications
Parameters and characteristics for this part
| Specification | IPC0184 |
|---|---|
| Board Thickness | 0.063 in |
| Material | FR4 Epoxy Glass |
| Number of Positions | 24 pos |
| Package Accepted | PowerSOIC |
| Pitch | 0.05 in |
| Proto Board Type | SMD, DIP |
| Size / Dimension Length | 1 in |
| Size / Dimension Width | 1.4 in |
Pricing
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CAD
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Documents
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