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BMI-C-002

BMI-C-002

Active
Laird Technologies EMI

RFI FINGERSTOCK BECU GOLD SOLDER

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BMI-C-002

BMI-C-002

Active
Laird Technologies EMI

RFI FINGERSTOCK BECU GOLD SOLDER

Find alt

Description

General part information

BMI-C-002

RFI FINGERSTOCK BECU GOLD SOLDER

Technical Specifications

Parameters and characteristics for this part

SpecificationBMI-C-002
Attachment MethodSolder
Height2.54 mm
Length0.085 in
MaterialBeryllium Copper
PlatingGold
TypeFingerstock
Width0.394 in

Pricing

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CAD

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Documents

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