
303M
ActiveWakefield Thermal Solutions
HEATSINK COMPACT

303M
ActiveWakefield Thermal Solutions
HEATSINK COMPACT
Description
General part information
303M
Heat Sink Stud Mounted Semiconductor Cases Aluminum Alloy 15.0W @ 37°C Board Level, Vertical
Technical Specifications
Parameters and characteristics for this part
| Specification | 303M |
|---|---|
| Attachment Method | Press Fit |
| Fin Height | 2 in |
| Length | 2 in |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
| Package Cooled | Stud Mounted Semiconductor Cases |
| Power Dissipation | 15 W |
| Shape | Fins, Rectangular |
| Thermal Resistance | 1.3 °C/W |
| Type | Vertical, Board Level |
| Width | 3 in |
Pricing
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CAD
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Documents
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