TC1-200G
ActiveChip Quik Inc.
HEAT SINK COMPOUND - HIGH DENSIT
TC1-200G
ActiveChip Quik Inc.
HEAT SINK COMPOUND - HIGH DENSIT
Description
General part information
TC1-200G
HEAT SINK COMPOUND - HIGH DENSIT
Technical Specifications
Parameters and characteristics for this part
| Specification | TC1-200G |
|---|---|
| Color | White |
| Shelf Life | 60 Months |
| Size / Dimension Shape | Jar |
| Size / Dimension Weight | 200 gram |
| Storage/Refrigeration Temperature (Maximum) | 77 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Thermal Conductivity | 0.67 W/m-K |
| Type | Silicone Compound |
Pricing
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CAD
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Documents
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