26176CTE
ActiveWakefield Thermal Solutions
HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, TO-263, 25.4 MM, 19.38 MM, 11.43 MM
26176CTE
ActiveWakefield Thermal Solutions
HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, TO-263, 25.4 MM, 19.38 MM, 11.43 MM
Description
General part information
26176CTE
HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, TO-263, 25.4 MM, 19.38 MM, 11.43 MM
Technical Specifications
Parameters and characteristics for this part
| Specification | 26176CTE |
|---|---|
| Attachment Method | Clip |
| Fin Height | 0.45 in |
| Length | 0.763 in |
| Material | Copper |
| Material Finish | Tin |
| Package Cooled | TO-263 (D²Pak) |
| Shape | Fins, Rectangular |
| Thermal Resistance | 11 °C/W |
| Type | Board Level |
| Width | 1 in |
Pricing
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