
BU24033GW-E2
ActiveRohm Semiconductor
MOTOR / MOTION / IGNITION CONTROLLERS & DRIVERS MICROSTEM SYSTEM LENS DRIVERS FOR DIGITAL CAMERAS

BU24033GW-E2
ActiveRohm Semiconductor
MOTOR / MOTION / IGNITION CONTROLLERS & DRIVERS MICROSTEM SYSTEM LENS DRIVERS FOR DIGITAL CAMERAS
Description
General part information
BU24033GW-E2
MOTOR / MOTION / IGNITION CONTROLLERS & DRIVERS MICROSTEM SYSTEM LENS DRIVERS FOR DIGITAL CAMERAS
Technical Specifications
Parameters and characteristics for this part
| Specification | BU24033GW-E2 |
|---|---|
| Applications | Camera |
| Current - Output (Max) | 600 mA |
| Current - Output (Min) | 0.5 A |
| Function | Control and Power Stage, Driver - Fully Integrated |
| Half-Bridge Count | 12 |
| Interface | Parallel |
| Motor Type - AC, DC | Voice Coil Motor, Brushed DC |
| Motor Type - Stepper | Bipolar |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -20 °C |
| Output Configuration | Half Bridge |
| Package / Case | CSPBGA, 40-VFBGA |
| Package Length | 3 mm |
| Package Name | 40-UCSP75M3 |
| Package Width | 3 mm |
| Step Resolution | 256 Microsteps |
| Technology | Power MOSFET |
| Voltage - Load (Max) | 5.5 V |
| Voltage - Load (Min) | 2.7 V |
| Voltage - Supply (Maximum) | 3.6 V |
| Voltage - Supply (Minimum) | 1.62 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Two-Resistor Model for Thermal Simulation
Solder Joint Rate and Thermal Resistance of Exposed Pad
BU24033GW Package Information
Basics of Thermal Resistance and Heat Dissipation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Five Steps for Successful Thermal Design of IC
PCB Layout Thermal Design Guide
Precautions When Measuring the Rear of the Package with a Thermocouple
BU24033GW Data Sheet
Compliance with the ELV directive
Factory Information
Judgment Criteria of Thermal Evaluation
Design Guide and Example of Stencil for Exposed Pad
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Thermal Resistance
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Impedance Characteristics of Bypass Capacitor
What Is Thermal Design