SMD291SNL250T3
ActiveChip Quik Inc.
SOLDER PASTE SAC305 250G T3
SMD291SNL250T3
ActiveChip Quik Inc.
SOLDER PASTE SAC305 250G T3
Description
General part information
SMD291SNL250T3
SOLDER PASTE SAC305 250G T3
Technical Specifications
Parameters and characteristics for this part
| Specification | SMD291SNL250T3 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Jar |
| Form Weight | 8.8 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Mesh Type | 3 |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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