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Description

General part information

HD6417751RBP200

IC MCU 32BIT ROMLESS 256BGA

Technical Specifications

Parameters and characteristics for this part

SpecificationHD6417751RBP200
ConnectivitySmartCard, EMI, SCI, EBI, FIFO
Core ProcessorSH-4
Core Size (Bit Width)32 Bit
Mounting TypeSurface Mount
Number of I/O39
Operating Temperature (Max)75 °C
Operating Temperature (Min)-20 °C
Oscillator TypeExternal
Package / Case256-BBGA
Package Length27 mm
Package Name256-BGA
Package Width27 mm
PeripheralsWDT, POR, DMA
Program Memory TypeROMless
RAM Size Depth48 K
RAM Size Width8 bit
Speed200 MHz
Voltage - Supply (Vcc/Vdd) Maximum1.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.35 V

Pricing

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