115-83-320-41-003101

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Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

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115-83-320-41-003101

Active

Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	2160	$ 1.46

Description

General part information

115-83 Series

20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	115-83-320-41-003101	115-83 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	29.5 Áin	29.5 Áin
Contact Finish Thickness - Mating	0.75 Ám	0.75 Ám
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	20	8 - 48
Number of Positions or Pins (Grid)	-	2 x 5
Number of Positions or Pins (Grid)	-	10
Number of Positions or Pins (Grid)	-	25
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	6 - 50
Number of Positions or Pins (Grid)	-	3 - 20
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	2.41 mm	2.41 mm
Termination Post Length	0.095 in	0.095 in
Type	0.3 "	0.2 - 0.9 in
Type	7.62 mm	5.08 - 22.86 mm
Type	DIP	DIP

115-83 Series

CONN IC DIP SOCKET 10POS GOLD

Part	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Contact Finish - Mating	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Resistance	Termination	Features	Contact Material - Mating	Housing Material	Material Flammability Rating	Type	Type	Type	Mounting Type	Number of Positions or Pins (Grid)
Preci-Dip 115-83-210-41-001101	Brass	2 x 5	10	-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	5.08 mm	0.2 in	Through Hole
Preci-Dip 115-83-324-41-001101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	24
Preci-Dip 115-83-308-41-001101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	8
Preci-Dip 115-83-636-41-001101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	15.24 mm	0.6 in	Through Hole	36
Preci-Dip 115-83-318-41-003101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	18
Preci-Dip 115-83-422-41-001101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	10.16 mm	0.4 in	Through Hole	22
Preci-Dip 115-83-628-41-003101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	15.24 mm	0.6 in	Through Hole	28
Preci-Dip 115-83-320-41-003101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	20
Preci-Dip 115-83-310-41-001101	Brass	2 x 5	10	-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole
Preci-Dip 115-83-308-41-003101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	8