ESQT-113-03-F-D-368

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Samtec Inc.

HEADERS & WIRE HOUSINGS FLEXYZ FLEXIBLE-HEIGHT SOCKET STRIP, 2.00MM PITCH

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ESQT-113-03-F-D-368

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Samtec Inc.

HEADERS & WIRE HOUSINGS FLEXYZ FLEXIBLE-HEIGHT SOCKET STRIP, 2.00MM PITCH

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	ESQT-113-03-F-D-368

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	3 µin
Contact Finish Thickness - Mating	0.076 µm
Contact Length - Post	0.09 "
Contact Length - Post	2.29 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Amps)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	9.35 mm
Insulation Height	0.368 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	26
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Style	Board to Board, Cable
Termination	Solder

ESQT-113 Series

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Part	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Material	Contact Finish - Post	Contact Length - Post	Contact Length - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Insulation Color	Fastening Type	Material Flammability Rating	Termination	Number of Positions	Contact Material	Pitch - Mating [x]	Pitch - Mating [x]	Style	Insulation Height	Insulation Height	Mounting Type	Row Spacing - Mating	Row Spacing - Mating	Number of Positions Loaded	Current Rating (Amps)	Contact Shape	Connector Type	Contact Type	Contact Length - Post [x]	Contact Length - Post [x]	Number of Rows	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. ESQT-113-03-M-Q-368	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.09 "	2.29 mm	0.51 µm	20 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	52	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	9.35 mm	0.368 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked
Samtec Inc. ESQT-113-03-L-S-335	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin			0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	13	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	8.51 mm	0.335 "	Through Hole			All	4.5 A	Square	Elevated Socket	Forked	3.12 mm	0.123 in	1
Samtec Inc. ESQT-113-02-GF-D-310	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Gold	0.54 in	13.72 mm	0.51 µm	20 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	7.87 mm	0.31 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2	3 µin	0.076 µm
Samtec Inc. ESQT-113-03-F-D-368	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.09 "	2.29 mm	0.076 µm	3 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	9.35 mm	0.368 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-03-L-D-325	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.133 in	3.38 mm	0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	8.25 mm	0.325 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-02-L-D-500	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin			0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	12.7 mm	0.5 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked	8.89 mm	0.35 in	2
Samtec Inc. ESQT-113-02-LM-D-425	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.425 in	10.8 mm	0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	10.8 mm	0.425 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-02-F-D-600	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.25 in	6.35 mm	0.076 µm	3 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	15.24 mm	0.6 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-02-F-D-310	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.54 in	13.72 mm	0.076 µm	3 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	7.87 mm	0.31 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-02-L-D-408	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.442 in	11.23 mm	0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	10.36 mm	0.408 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 6.96
Sager	N/A	1	$ 3.90
		25	$ 3.48
		50	$ 3.07
		100	$ 2.69
		500	$ 2.50
		1000	$ 2.03
		2500	$ 1.56
		5000	$ 1.18

Description

General part information

ESQT-113 Series

26 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

Datasheet

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