SDL-118 Series

Part	Contact Finish - Post	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Termination	Number of Positions	Number of Rows	Mounting Type	Fastening Type	Number of Positions Loaded	Connector Type	Insulation Height	Style	Contact Type	Row Spacing - Mating	Insulation Color	Contact Length - Post	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Post	Contact Material	Insulation Material	Contact Shape
Samtec Inc. SDL-124-G-12	Gold	0.1 in	Gold	30 µin	Solder	48	2	Through Hole	Push-Pull	All	Receptacle	0.095 in	Board	Female Socket	0.1 in	Black	0.095 in	125 °C	-55 °C	10 µin	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-124-T-12		0.1 in	Gold	30 µin	Solder	48	2	Through Hole	Push-Pull	All	Receptacle	0.095 in	Board	Female Socket	0.1 in	Black	0.095 in	125 °C	-55 °C		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-124-G-10	Gold	0.1 in	Gold	30 µin	Solder	48	2	Through Hole	Push-Pull	All	Receptacle	0.122 in	Board	Female Socket	0.1 in	Black	0.108 in	125 °C	-55 °C	10 µin	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-124-T-10		0.1 in	Gold	30 µin	Solder	48	2	Through Hole	Push-Pull	All	Receptacle	0.122 in	Board	Female Socket	0.1 in	Black	0.108 in	125 °C	-55 °C		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular

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