
658-25ABT4
ObsoleteWakefield Thermal Solutions
HEATSINK CPU 28MM SQ BLK W/TAPE

658-25ABT4
ObsoleteWakefield Thermal Solutions
HEATSINK CPU 28MM SQ BLK W/TAPE
Description
General part information
658-25ABT4
Heat Sink BGA Aluminum 2.0W @ 40°C Top Mount
Technical Specifications
Parameters and characteristics for this part
| Specification | 658-25ABT4 |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Fin Height | 0.25 in |
| Length | 1.1 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | BGA |
| Power Dissipation | 2 W |
| Shape | Square, Pin Fins |
| Thermal Resistance | 5 °C/W |
| Type | Top Mount |
| Width | 1.1 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources