Specification	XCVM1102-1LSESFVA784

Architecture	MPU, FPGA
Connectivity	USART, SD, USB OTG, CANbus, MMC, EBI, UART, Ethernet, SPI, I2C, SDIO, EMI
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	0 °C
Package / Case	FCBGA, 784-BFBGA
Package Length	23 mm
Package Name	784-FCBGA
Package Width	23 mm
Peripherals	DDR, DMA, PCIe
Primary Attributes	Versal™ Prime FPGA, 329K Logic Cells
RAM Size	256 KB
Speed	400 MHz, 1 GHz

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