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DIP600T300P18

DIP600T300P18

Active
Chip Quik Inc.

DIP-18 (0.6" BODY) TO DIP-18 (0.

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DIP600T300P18

DIP600T300P18

Active
Chip Quik Inc.

DIP-18 (0.6" BODY) TO DIP-18 (0.

Find alt

Description

General part information

DIP600T300P18

DIP-18 (0.6" BODY) TO DIP-18 (0.

Technical Specifications

Parameters and characteristics for this part

SpecificationDIP600T300P18
Board Thickness0.063 in
MaterialFR4 Epoxy Glass
Number of Positions18
Pitch0.1 in
Proto Board TypeDIP
Size / Dimension Length0.9 in
Size / Dimension Width0.7 in

Pricing

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CAD

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Documents

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