4860P-500G
ObsoleteMG Chemicals
LEADED SOLDER PASTE, SN63/PB37,
4860P-500G
ObsoleteMG Chemicals
LEADED SOLDER PASTE, SN63/PB37,
Description
General part information
4860P-500G
LEADED SOLDER PASTE, SN63/PB37,
Technical Specifications
Parameters and characteristics for this part
| Specification | 4860P-500G |
|---|---|
| Composition | Pb37, Sn63 |
| Form | Jar |
| Form Weight | 17.64 oz |
| Melting Point | 361 °F |
| Mesh Type | 3 |
| Process | Leaded |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature (Maximum) | 50 °F |
| Storage/Refrigeration Temperature (Minimum) | 35 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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