Specification	SIP1X08-001BLF

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Closed Frame
Grid Columns	8
Grid Rows	1
Housing Material	PPS, Glass Filled, Polyphenylene Sulfide
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	8
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Type	SIP

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