NC191LTA250
ActiveChip Quik Inc.
SMOOTH FLOW LOW TEMP SOLDER PAST
NC191LTA250
ActiveChip Quik Inc.
SMOOTH FLOW LOW TEMP SOLDER PAST
Description
General part information
NC191LTA250
SMOOTH FLOW LOW TEMP SOLDER PAST
Technical Specifications
Parameters and characteristics for this part
| Specification | NC191LTA250 |
|---|---|
| Ag Composition | 1 % |
| Bi Composition | 57 % |
| Composition Elements | Bi, Ag, Sn |
| Composition Formula | Bi57Sn42Ag1 |
| Form | Jar |
| Form Weight | 8.8 oz |
| Melting Point | 279 °F |
| Mesh Type | 4 |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 42 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources