SMD3SW.015 100G
ActiveChip Quik Inc.
SOLDER SOLDER WIRE 62/36/2 TIN/LEAD/SILVER NO-CLEAN .015 100G ULTRA THIN
SMD3SW.015 100G
ActiveChip Quik Inc.
SOLDER SOLDER WIRE 62/36/2 TIN/LEAD/SILVER NO-CLEAN .015 100G ULTRA THIN
Description
General part information
SMD3SW.015 100G
SOLDER SOLDER WIRE 62/36/2 TIN/LEAD/SILVER NO-CLEAN .015 100G ULTRA THIN
Technical Specifications
Parameters and characteristics for this part
| Specification | SMD3SW.015 100G |
|---|---|
| Ag Composition | 2 % |
| Composition Elements | Sn, Ag, Pb |
| Composition Formula | Sn62Pb36Ag2 |
| Diameter | 0.015 in |
| Flux Type | Water Soluble, No-Clean |
| Form | Spool |
| Form Weight | 3.53 oz |
| Melting Point | 354 °F |
| Process | Leaded |
| Sn Composition | 62 % |
| Type | Wire Solder |
| Wire Gauge | 28 SWG, 27 AWG |
Pricing
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CAD
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