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100-024-051

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3M

CONN IC DIP SOCKET 24POS GOLD

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100-024-051

Active
3M

CONN IC DIP SOCKET 24POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification100-024-051100-024 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold
Contact Finish Thickness - Mating0.203 Ám0.203 Ám
Contact Finish Thickness - Mating8 Áin8 Áin
Contact Finish Thickness - PostFlashFlash
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - Post [custom]BrassBrass
Current Rating (Amps)1 A1 A
FeaturesSeal Tape, Closed FrameOpen Frame, Seal Tape, Closed Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass FilledPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole
Number of Positions or Pins (Grid)2424
Operating Temperature [Max]125 °C125 °C
Operating Temperature [Min]-65 ░C-65 ░C
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Pitch - Post2.54 mm2.54 mm
Pitch - Post0.1 in0.1 in
TerminationSolderSolder
Termination Post Length3.2 mm3.2 mm
Termination Post Length0.126 in0.126 in
TypeDIPDIP
Type0.6 in0.6 in
Type15.24 mm15.24 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

100-024 Series

CONN IC DIP SOCKET 24POS GOLD

PartHousing MaterialMounting TypeContact Finish - PostPitch - PostPitch - PostFeaturesCurrent Rating (Amps)TerminationContact Material - MatingNumber of Positions or Pins (Grid)Material Flammability RatingContact Finish - MatingContact Finish Thickness - MatingContact Finish Thickness - MatingTermination Post LengthTermination Post LengthContact Material - Post [custom]Operating Temperature [Max]Operating Temperature [Min]Contact Finish Thickness - PostTypeTypeTypePitch - MatingPitch - Mating
Polyphenylene Sulfide (PPS), Glass Filled
Through Hole
Gold
2.54 mm
0.1 in
Open Frame
1 A
Solder
Beryllium Copper
24
UL94 V-0
Gold
0.203 Ám
8 Áin
3.2 mm
0.126 in
Brass
125 °C
-65 ░C
Flash
DIP
0.6 in
15.24 mm
0.1 in
2.54 mm
Polyphenylene Sulfide (PPS), Glass Filled
Through Hole
Gold
2.54 mm
0.1 in
Closed Frame, Seal Tape
1 A
Solder
Beryllium Copper
24
UL94 V-0
Gold
0.203 Ám
8 Áin
3.2 mm
0.126 in
Brass
125 °C
-65 ░C
Flash
DIP
0.6 in
15.24 mm
0.1 in
2.54 mm

Description

General part information

100-024 Series

24 (2 x 12) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available