ESQT-112-02-G-D-624-001

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Samtec Inc.

CONN SOCKET 24POS 0.079 GOLD PCB

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ESQT-112-02-G-D-624-001

Active

Samtec Inc.

CONN SOCKET 24POS 0.079 GOLD PCB

Deep-Dive with AI

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Technical Specifications

Parameters and characteristics for this part

Specification	ESQT-112-02-G-D-624-001

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Post	0.226 in
Contact Length - Post	5.74 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Amps)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	15.85 mm
Insulation Height	0.624 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	24
Number of Positions Loaded	23
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Style	Board to Board, Cable
Termination	Solder

ESQT-112 Series

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Part	Pitch - Mating [x]	Pitch - Mating [x]	Contact Finish - Post	Number of Positions Loaded	Contact Shape	Row Spacing - Mating	Row Spacing - Mating	Style	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Height	Insulation Height	Material Flammability Rating	Contact Length - Post	Contact Length - Post	Mounting Type	Insulation Material	Fastening Type	Insulation Color	Connector Type	Termination	Current Rating (Amps)	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions	Contact Material	Contact Type	Number of Rows	Contact Length - Post [x]	Contact Length - Post [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions Loaded
Samtec Inc. ESQT-112-03-L-Q-375	0.079 in	2 mm	Tin	All	Square	0.079 in	2 mm	Board to Board Cable	10 çin	0.25 çm	0.375 in	9.53 mm	UL94 V-0	0.083 in	2.11 mm	Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	48	Phosphor Bronze	Forked
Samtec Inc. ESQT-112-03-L-D-374	0.079 in	2 mm	Tin	All	Square	0.079 in	2 mm	Board to Board Cable	10 çin	0.25 çm	0.374 in	9.5 mm	UL94 V-0	0.084 in	2.13 mm	Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	24	Phosphor Bronze	Forked	2
Samtec Inc. ESQT-112-02-F-5-375	0.079 in	2 mm	Tin	All	Square	0.079 in	2 mm	Board to Board Cable	3 µin	0.076 µm	0.375 in	9.53 mm	UL94 V-0			Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	60	Phosphor Bronze	Forked	5	12.07 mm	0.475 in
Samtec Inc. ESQT-112-03-G-Q-310	0.079 in	2 mm	Gold	All	Square	0.079 in	2 mm	Board to Board Cable	20 µin	0.51 µm	0.31 in	7.87 mm	UL94 V-0	0.148 in	3.76 mm	Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	48	Phosphor Bronze	Forked				3 µin	0.076 µm
Samtec Inc. ESQT-112-02-G-D-650	0.079 in	2 mm	Gold	All	Square	0.079 in	2 mm	Board to Board Cable	20 µin	0.51 µm	0.65 in	16.5 mm	UL94 V-0			Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	24	Phosphor Bronze	Forked	2	5.08 mm	0.2 in	3 µin	0.076 µm
Samtec Inc. ESQT-112-03-F-Q-335	0.079 in	2 mm	Tin	All	Square	0.079 in	2 mm	Board to Board Cable	3 µin	0.076 µm	0.335 "	8.51 mm	UL94 V-0			Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	48	Phosphor Bronze	Forked		3.12 mm	0.123 in
Samtec Inc. ESQT-112-03-G-S-380	0.079 in	2 mm	Gold	All	Square			Board to Board Cable	20 µin	0.51 µm	0.38 in	9.65 mm	UL94 V-0			Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	12	Phosphor Bronze	Forked	1	1.98 mm	0.078 in	3 µin	0.076 µm
Samtec Inc. ESQT-112-02-L-5-708	0.079 in	2 mm	Tin	All	Square	0.079 in	2 mm	Board to Board Cable	10 çin	0.25 çm	0.708 in	17.98 mm	UL94 V-0	0.142 in	3.6 mm	Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	60	Phosphor Bronze	Forked	5
Samtec Inc. ESQT-112-02-G-S-800-012	0.079 in	2 mm	Gold		Square			Board to Board Cable	20 µin	0.51 µm	0.8 in	20.32 mm	UL94 V-0	0.05 in	1.27 mm	Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	12	Phosphor Bronze	Forked	1			3 µin	0.076 µm	11
Samtec Inc. ESQT-112-02-G-D-624-001	0.079 in	2 mm	Gold		Square	0.079 in	2 mm	Board to Board Cable	20 µin	0.51 µm	0.624 in	15.85 mm	UL94 V-0	0.226 in	5.74 mm	Through Hole	Liquid Crystal Polymer (LCP)	Push-Pull	Black	Elevated Socket	Solder	4.5 A	Gold	-55 °C	125 °C	24	Phosphor Bronze	Forked	2			3 µin	0.076 µm	23

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

ESQT-112 Series

24 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

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