The trend towards miniaturization also affects sensor technology: applications such as mobile phones or joysticks for industry, medicine or consumer electronics such as game consoles are using sensors on an ever-increasing scale with often limited installation space. Here, the miniaturization of the sensors allows on the one hand a more compact design or on the other hand the integration of further functionalities on the same construction space. The use of magnetic sensors improves robustness, susceptibility to environmental influences such as dirt and moisture and extends the product life and reliability of the respective product. Against this background, Infineon has developed the TLI493D-W2BW 3D magnetic sensor, which opens up completely new design options with its powerful features in the extremely small wafer-level housing. New features were added such as sensor address read back, half mode range setting, focusing to half of the magnetic range ensuring higher accuracy, higher update frequency allows for an application field that requires faster update speed as well as angular mode (for x and y read out only). TLI493D-W2BWis available in 4 different variants ending with A0, A1, A2 or A3. The underlying feature is the so called Bus mode configuration of this device. It’s possible to connect up to 4 sensors to one I²C bus. The specific addressing is then done via 4 different variants.