1N4690UR-1
ActiveZENER DIODE SINGLE 2-PIN 5.6V, 5%, 500MW DO-213AA BAG
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1N4690UR-1
ActiveZENER DIODE SINGLE 2-PIN 5.6V, 5%, 500MW DO-213AA BAG
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 1N4690UR-1 | 1N4690UR-1-Zener-Diode Series |
|---|---|---|
| Current - Reverse Leakage @ Vr | 10 µA | 10 µA |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 347 °F | 347 °F |
| Operating Temperature [Min] | -65 ░C | -65 ░C |
| Package / Case | DO-213AA | DO-213AA |
| Power - Max [Max] | 500 mW | 500 mW |
| Supplier Device Package | DO-213AA | DO-213AA |
| Tolerance | 5 % | 5 % |
| Voltage - Forward (Vf) (Max) @ If [Max] | 1.5 V | 1.5 V |
| Voltage - Zener (Nom) (Vz) | 5.6 V | 5.6 V |
1N4690UR-1-Zener-Diode Series
Zener Diode Single 2-Pin 5.6V, 5%, 500mW DO-213AA Bag
| Part | Power - Max [Max] | Voltage - Forward (Vf) (Max) @ If [Max] | Tolerance | Operating Temperature [Min] | Operating Temperature [Max] | Voltage - Zener (Nom) (Vz) | Supplier Device Package | Package / Case | Mounting Type | Current - Reverse Leakage @ Vr |
|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology 1N4690UR-1 | 500 mW | 1.5 V | 5 % | -65 ░C | 347 °F | 5.6 V | DO-213AA | DO-213AA | Surface Mount | 10 µA |
Microchip Technology 1N4690UR-1/TR | 500 mW | 1.5 V | 5 % | -65 ░C | 347 °F | 5.6 V | DO-213AA | DO-213AA | Surface Mount | 10 µA |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 186 | $ 4.41 | |
| Microchip Direct | N/A | 1 | $ 4.75 | |
| Newark | Each | 100 | $ 4.41 | |
| 500 | $ 4.23 | |||
Description
General part information
1N4690UR-1-Zener-Diode Series
The 1N4678UR-1 thru 1N4717UR-1 series of 0.5 watt glass surface mount DO-213AA Zener voltage regulators provides a selection from 1.8 to 43 volts. Standard tolerance is +/-5%, with 1% and 2% options available. The Zener test current is only 50 uA. The metal slugs that sandwich the die are metallurgically bonded to the silicon for high reliability. This type of internally bonded Zener package construction is also available with high-reliability up screening as described in the Features section. Microchip also offers numerous other Zener products to meet higher and lower power applications.
Documents
Technical documentation and resources