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INFINEON IMZA65R039M1HXKSA1

IMZA65R083M1HXKSA1

NRND
INFINEON

THE IMZA65R048M1H COOLSIC™ MOSFET 650V IS BUILT ON A STATE-OF-THE-ART TRENCH SEMICONDUCTOR.

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INFINEON IMZA65R039M1HXKSA1

IMZA65R083M1HXKSA1

NRND
INFINEON

THE IMZA65R048M1H COOLSIC™ MOSFET 650V IS BUILT ON A STATE-OF-THE-ART TRENCH SEMICONDUCTOR.

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Description

General part information

IMZA65R083M1HXKSA1

CoolSiC™ MOSFETtechnology leverages the strong physical characteristics of silicon carbide, adding unique features that increase the device’s performance, robustness, and ease of use. The IMZA65R048M1H CoolSiC™ MOSFET 650V is built on a state-of-the-art trench semiconductor, optimized to allow no compromises in getting both thelowest losses in the applicationand thehighest reliability in operation. Infineon’s SiC MOSFET in TO247 4-pin package reduces parasitic source inductance effects on the gate circuit enabling faster switching and increased efficiency.

Technical Specifications

Parameters and characteristics for this part

SpecificationIMZA65R083M1HXKSA1
Current - Continuous Drain (Id) (Tc)26 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)18 V
FET TypeN-Channel
Gate Charge (Max)19 nC
Input Capacitance (Ciss) (Max)624 pF
Mounting TypeThrough Hole
Operating Temperature (Max)175 °C
Operating Temperature (Min)-55 °C
Package / CaseTO-247-4
Package NamePG-TO247-4-3
Power Dissipation (Max)104 W
Rds On (Max)111 mOhm
TechnologySiCFET (Silicon Carbide)
Vgs (Max) Negative-2 V
Vgs (Max) Positive20 V
Vgs(th) (Max)5.7 V

Pricing

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CAD

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