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IMDQ65R020M2HXUMA1

IMDQ65R020M2HXUMA1

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INFINEON

COOLSIC™ MOSFET 650 V G2 IN Q-DPAK TOP-SIDE COOLING PACKAGE, 20 MΩ

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IMDQ65R020M2HXUMA1

IMDQ65R020M2HXUMA1

Active
INFINEON

COOLSIC™ MOSFET 650 V G2 IN Q-DPAK TOP-SIDE COOLING PACKAGE, 20 MΩ

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Description

General part information

IMDQ65R020M2HXUMA1

The CoolSiC™ MOSFET 650 V Generation 2 (G2) in Q-DPAK utilizes the G2 superior switching performance, which also provides the advantages of top-side cooling. This innovation enhances the current offerings of CoolSiC™ in TOLT and CoolMOS™ in Q-DPAK packages, facilitating comprehensive system-level enhancements, including reductions in board space and BOM costs, as well as maximization of system power density.

Technical Specifications

Parameters and characteristics for this part

SpecificationIMDQ65R020M2HXUMA1
Current - Continuous Drain (Id) (Tc)97 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On)15 V
Drive Voltage (Min Rds On)20 V
FET TypeN-Channel
Gate Charge (Max)57 nC
Input Capacitance (Ciss) (Max)2038 pF, 2038 pF
Mounting TypeSurface Mount
Operating Temperature (Max)175 °C
Operating Temperature (Min)-55 °C
Package / Case22-PowerBSOP Module
Package NamePG-HDSOP-22-1
Power Dissipation (Max)394 W
Rds On (Max)18 mOhm
TechnologySiCFET (Silicon Carbide)
Vgs (Max) Negative-7 V
Vgs (Max) Positive23 V
Vgs(th) (Max)5.6 V

Pricing

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CAD

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Documents

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