W66BP6NBHAHJ
ActiveWinbond Electronics
IC DRAM 2GBIT LVSTL 11 100VFBGA
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W66BP6NBHAHJ
ActiveWinbond Electronics
IC DRAM 2GBIT LVSTL 11 100VFBGA
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | W66BP6NBHAHJ | W66BP6 Series |
---|---|---|
- | - | |
Access Time | 3.6 ns | 3.6 ns |
Clock Frequency | 2.133 GHz | 1.6 - 1866 GHz |
Memory Format | DRAM | DRAM |
Memory Organization | 128 M | 128 M |
Memory Size | 2 Gbit | 2 Gbit |
Memory Type | Volatile | Volatile |
Mounting Type | Surface Mount | Surface Mount |
Operating Temperature [Max] | 105 °C | 105 °C |
Operating Temperature [Min] | -40 °C | -40 °C |
Package / Case | 100-VFBGA | 200-WFBGA, 100-VFBGA |
Supplier Device Package | 100-VFBGA | 200-WFBGA (10x14.5), 100-VFBGA |
Supplier Device Package [x] | 10 | 10 |
Supplier Device Package [y] | 7.5 | 7.5 |
Technology | SDRAM - Mobile LPDDR4 | SDRAM - Mobile LPDDR4 |
Voltage - Supply [Max] | 1.95 V, 1.17 V | 1.17 - 1.95 V |
Voltage - Supply [Min] | 1.06 V, 1.7 V | 1.06 - 1.7 V |
Write Cycle Time - Word, Page | 18 ns | 18 ns |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Distributor | Package | Quantity | $ | |
---|---|---|---|---|
Digikey | Tray | 208 | $ 3.12 |
W66BP6 Series
IC DRAM 2GBIT LVSTL 11 200WFBGA
Part | Mounting Type | Memory Type | Write Cycle Time - Word, Page | Package / Case | Memory Format | Operating Temperature [Max] | Operating Temperature [Min] | Clock Frequency | Voltage - Supply [Min] | Voltage - Supply [Max] | Technology | Memory Size | Memory Organization | Supplier Device Package | Supplier Device Package [x] | Supplier Device Package [y] | Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W66BP6NBUAHJ | Surface Mount | Volatile | 18 ns | 200-WFBGA | DRAM | 105 °C | -40 °C | 2.133 GHz | 1.06 V, 1.7 V | 1.17 V, 1.95 V | SDRAM - Mobile LPDDR4 | 2 Gbit | 128 M | 200-WFBGA (10x14.5) | |||
Winbond Electronics W66BP6NBUAFJ TR | Surface Mount | Volatile | 18 ns | 200-WFBGA | DRAM | 105 °C | -40 °C | 1.6 GHz | 1.06 V, 1.7 V | 1.17 V, 1.95 V | SDRAM - Mobile LPDDR4 | 2 Gbit | 128 M | 200-WFBGA (10x14.5) | |||
Winbond Electronics W66BP6NBUAGJ | Surface Mount | Volatile | 18 ns | 200-WFBGA | DRAM | 105 °C | -40 °C | 1866 MHz | 1.06 V, 1.7 V | 1.17 V, 1.95 V | SDRAM - Mobile LPDDR4 | 2 Gbit | 128 M | 200-WFBGA (10x14.5) | |||
Winbond Electronics W66BP6NBUAHJ TR | Surface Mount | Volatile | 18 ns | 200-WFBGA | DRAM | 105 °C | -40 °C | 2.133 GHz | 1.06 V, 1.7 V | 1.17 V, 1.95 V | SDRAM - Mobile LPDDR4 | 2 Gbit | 128 M | 200-WFBGA (10x14.5) | |||
Winbond Electronics W66BP6NBHAHJ | Surface Mount | Volatile | 18 ns | 100-VFBGA | DRAM | 105 °C | -40 °C | 2.133 GHz | 1.06 V, 1.7 V | 1.17 V, 1.95 V | SDRAM - Mobile LPDDR4 | 2 Gbit | 128 M | 100-VFBGA | 10 | 7.5 | 3.6 ns |
Winbond Electronics W66BP6NBUAGJ TR | Surface Mount | Volatile | 18 ns | 200-WFBGA | DRAM | 105 °C | -40 °C | 1866 MHz | 1.06 V, 1.7 V | 1.17 V, 1.95 V | SDRAM - Mobile LPDDR4 | 2 Gbit | 128 M | 200-WFBGA (10x14.5) | |||
Winbond Electronics W66BP6NBUAGJ | |||||||||||||||||
Winbond Electronics W66BP6NBUAFJ | Surface Mount | Volatile | 18 ns | 200-WFBGA | DRAM | 105 °C | -40 °C | 1.6 GHz | 1.06 V, 1.7 V | 1.17 V, 1.95 V | SDRAM - Mobile LPDDR4 | 2 Gbit | 128 M | 200-WFBGA (10x14.5) |
Description
General part information
W66BP6 Series
SDRAM - Mobile LPDDR4 Memory IC 2Gbit LVSTL_11 2.133 GHz 3.6 ns 100-VFBGA (10x7.5)
Documents
Technical documentation and resources
No documents available