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ISC012N04LM6ATMA1 - ISC015N04NM5

ISC012N04LM6ATMA1

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Infineon Technologies

THE ISC012N04LM6 OPTIMOS™ 6 40V IN LOGIC LEVEL IS SETTING A NEW TECHNOLOGY STANDARD IN THE FIELD OF DISCRETE POWER MOSFETS.

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ISC012N04LM6ATMA1 - ISC015N04NM5

ISC012N04LM6ATMA1

Active
Infineon Technologies

THE ISC012N04LM6 OPTIMOS™ 6 40V IN LOGIC LEVEL IS SETTING A NEW TECHNOLOGY STANDARD IN THE FIELD OF DISCRETE POWER MOSFETS.

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationISC012N04LM6ATMA1
Current - Continuous Drain (Id) @ 25°C238 A, 37 A
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]64 nC
Input Capacitance (Ciss) (Max) @ Vds4600 pF
Mounting TypeSurface Mount
Operating Temperature [Max]175 ░C
Operating Temperature [Min]-55 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)3 W, 125 W
Rds On (Max) @ Id, Vgs1.2 mOhm
Supplier Device PackagePG-TDSON-8 FL
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.98
10$ 1.93
100$ 1.34
500$ 1.08
1000$ 1.00
2000$ 0.94
Digi-Reel® 1$ 2.98
10$ 1.93
100$ 1.34
500$ 1.08
1000$ 1.00
2000$ 0.94
Tape & Reel (TR) 5000$ 0.94

Description

General part information

ISC012N Series

The ISC012N04LM6OptiMOSTM6 40Vin logic level is setting a new technology standard in the field of discrete power MOSFETs. Compared to alternative products, Infineon’s leading thin wafer technology is enabling significant performance benefits. Infineon’s OptiMOS™ 6 power MOSFET 40 V family is optimized for a variety of applications and circuits, such as synchronous rectification inswitched mode power supplies(SMPS) inservers,desktop PCs,wireless chargers,quick chargersand ORing circuits. Improvements in on-state resistance (RDS(on)) and figure of merits (FOM - RDS(on)x Qgand Qgd) enable designers to increase efficiency, allowing easier thermal design and less paralleling, leading to system cost reduction.

Documents

Technical documentation and resources