Zenode.ai Logo

W63CH6MBVACE

Active
Winbond Electronics

IC DRAM 4GBIT PAR 178VFBGA

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

W63CH6MBVACE

Active
Winbond Electronics

IC DRAM 4GBIT PAR 178VFBGA

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationW63CH6MBVACE
Clock Frequency933 MHz
Memory FormatDRAM
Memory InterfaceParallel
Memory Organization256 M
Memory Size512 kb
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-25 °C
Package / Case178-VFBGA
Supplier Device Package178-VFBGA
Supplier Device Package [x]11
Supplier Device Package [y]11.5
TechnologySDRAM - Mobile LPDDR3
Voltage - Supply [Max]1.95 V, 1.3 V
Voltage - Supply [Min]1.7 V, 1.14 V
Write Cycle Time - Word, Page15 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

W63CH6 Series

IC DRAM 4GBIT PAR 178VFBGA

PartWrite Cycle Time - Word, PageMounting TypeMemory TypeMemory FormatOperating Temperature [Min]Operating Temperature [Max]TechnologyMemory OrganizationVoltage - Supply [Min]Voltage - Supply [Max]Package / CaseMemory InterfaceClock FrequencySupplier Device PackageSupplier Device Package [y]Supplier Device Package [x]Memory Size
Winbond Electronics
W63CH6MBVACE
15 ns
Surface Mount
Volatile
DRAM
-25 °C
85 °C
SDRAM - Mobile LPDDR3
256 M
1.14 V, 1.7 V
1.3 V, 1.95 V
178-VFBGA
Parallel
933 MHz
178-VFBGA
11.5
11
512 kb

Description

General part information

W63CH6 Series

SDRAM - Mobile LPDDR3 Memory IC 4Gbit Parallel 933 MHz 178-VFBGA (11x11.5)

Documents

Technical documentation and resources