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PA0192

PA0192

Active
Chip Quik Inc.

TSSOP-14-EXP-PAD TO DIP-14 SMT

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PA0192

PA0192

Active
Chip Quik Inc.

TSSOP-14-EXP-PAD TO DIP-14 SMT

Find alt

Description

General part information

PA0192

TSSOP-14-EXP-PAD TO DIP-14 SMT

Technical Specifications

Parameters and characteristics for this part

SpecificationPA0192
Board Thickness0.062 in
MaterialFR4 Epoxy Glass
Number of Positions14
Package AcceptedTSSOP
Pitch0.026 in
Proto Board TypeSMD, DIP
Size / Dimension Length0.7 in
Size / Dimension Width0.7 in

Pricing

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CAD

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Documents

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