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INFINEON IQE013N04LM6CGSCATMA1

IQE030N06NM5CGSCATMA1

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INFINEON

OPTIMOS™ LOW-VOLTAGE POWER MOSFET 60 V IN PQFN 3.3X3.3 SOURCE-DOWN DSC PACKAGE WITH INDUSTRY LEADING RDS(ON) AND SUPERIOR THERMAL PERFORMANCE

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INFINEON IQE013N04LM6CGSCATMA1

IQE030N06NM5CGSCATMA1

Active
INFINEON

OPTIMOS™ LOW-VOLTAGE POWER MOSFET 60 V IN PQFN 3.3X3.3 SOURCE-DOWN DSC PACKAGE WITH INDUSTRY LEADING RDS(ON) AND SUPERIOR THERMAL PERFORMANCE

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Description

General part information

IQE030N06NM5CGSCATMA1

Infineon is presenting the new product of the portfolio extension for the innovativeSource-Downtechnology: theOptiMOSTM5 60 VPQFN 3.3x3.3 Source-Down: IQE030N06NM5CGSC. The revolutionary Source-Down technology introduces a flipped silicon die, which is positioned upside down inside of the components. This adjustment allows the source potential (instead of the drain potential) to be connected to the PCB over the thermal pad. Therefore, it offers several advantages, such as increased thermal capability, advanced power density or improved layout possibilities. Furthermore, the higher efficiency, the reduced active cooling requirements and the effective layout for thermal management are benefits at the system level. Thanks to the new benchmark RDS(on)and the innovative layout capacities enable the Source-Down concept to have a leading position in temperature management. Moreover, with the dual-side cooling package three times more power can be dissipated compared to the overmolded package. The Source-Down portfolio is addressing applications, such as drives, telecom, SMPS or server. The new technology can be found in two different footprints for now: Source-Down Standard-Gate and Source-Down Center-Gate (optimized for parallelization).

Technical Specifications

Parameters and characteristics for this part

SpecificationIQE030N06NM5CGSCATMA1
Current - Continuous Drain (Id) (Ta)21 A
Current - Continuous Drain (Id) (Tc)132 A
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On)6 V
Drive Voltage (Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Max)49 nC, 49 nC
Input Capacitance (Ciss) (Max)3800 pF
Mounting TypeSurface Mount
Operating Temperature (Max)175 °C
Operating Temperature (Min)-55 °C
Package / Case9-PowerWDFN
Package NamePG-WHTFN-9-1
Power Dissipation (Max)2.5 W, 100 W
Rds On (Max)3 mOhm
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max)3.3 V

Pricing

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CAD

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