Specification	XCVC2602-1LSIVSVH1760

Architecture	MPU, FPGA
Connectivity	USART, SD, USB OTG, CANbus, MMC, EBI, UART, Ethernet, SPI, I2C, SDIO, EMI
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Logic Elements	820 K Logic Cells
Operating Temperature (Max)	110 °C
Operating Temperature (Min)	-40 °C
Package / Case	1760-BFBGA, FCBGA
Package Length	40 mm
Package Name	1760-FCBGA
Package Width	40 mm
Peripherals	DDR, DMA, PCIe
Primary Attributes	Versal™ AI Core FPGA, Versal™ AI Core FPGA, 820K Logic Cells
RAM Size	256 KB
Speed	400 MHz, 1 GHz

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