ESQT-118-03-G-Q-368

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Samtec Inc.

CONN SOCKET 72POS 0.079 GOLD PCB

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ESQT-118-03-G-Q-368

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Samtec Inc.

CONN SOCKET 72POS 0.079 GOLD PCB

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	ESQT-118-03-G-Q-368

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Post	0.09 "
Contact Length - Post	2.29 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Amps)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	9.35 mm
Insulation Height	0.368 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	72
Number of Positions Loaded	All
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Style	Board to Board, Cable
Termination	Solder

ESQT-118 Series

Part	Number of Positions Loaded	Contact Length - Post	Contact Length - Post	Contact Type	Number of Positions	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Connector Type	Contact Finish - Mating	Insulation Color	Mounting Type	Material Flammability Rating	Style	Insulation Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Fastening Type	Contact Shape	Row Spacing - Mating	Row Spacing - Mating	Contact Material	Number of Rows	Current Rating (Amps)	Insulation Height	Insulation Height	Contact Finish - Post	Pitch - Mating [x]	Pitch - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post [x]	Contact Length - Post [x]
Samtec Inc. ESQT-118-03-F-D-375	All	0.083 in	2.11 mm	Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	3 µin	0.076 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.375 in	9.53 mm	Tin	0.079 in	2 mm
Samtec Inc. ESQT-118-02-G-T-532	All	0.318 in	8.08 mm	Forked	54	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	3	4.5 A	0.532 "	13.51 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm
Samtec Inc. ESQT-118-03-G-D-329	All	0.129 "	3.28 mm	Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.329 in	8.36 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm
Samtec Inc. ESQT-118-02-G-T-700	All			Forked	54	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	3	4.5 A	0.7 in	17.78 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm	0.15 in	3.81 mm
Samtec Inc. ESQT-118-03-G-D-380	All			Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.38 in	9.65 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm	0.078 in	1.98 mm
Samtec Inc. ESQT-118-03-G-Q-368	All	0.09 "	2.29 mm	Forked	72	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze		4.5 A	0.368 in	9.35 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm
Samtec Inc. ESQT-118-02-M-D-790	All			Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.79 in	20.07 mm	Tin	0.079 in	2 mm			0.06 in	1.52 mm
Samtec Inc. ESQT-118-02-G-D-500	All			Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.5 in	12.7 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm	0.35 in	8.89 mm
Samtec Inc. ESQT-118-02-F-D-400	All	0.45 "	11.43 mm	Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	3 µin	0.076 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.4 in	10.16 mm	Tin	0.079 in	2 mm
Samtec Inc. ESQT-118-02-G-D-790	All			Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.79 in	20.07 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm	0.06 in	1.52 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	15	$ 28.17

Description

General part information

ESQT-118 Series

72 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available