TS991LT500T4C
ActiveChip Quik Inc.
SOLDER PASTE SN42/BI57.6/AG0.4 T
TS991LT500T4C
ActiveChip Quik Inc.
SOLDER PASTE SN42/BI57.6/AG0.4 T
Description
General part information
TS991LT500T4C
SOLDER PASTE SN42/BI57.6/AG0.4 T
Technical Specifications
Parameters and characteristics for this part
| Specification | TS991LT500T4C |
|---|---|
| Ag Composition | 0.4 % |
| Bi Composition | 57 % |
| Composition Elements | Sn, Ag, Bi |
| Composition Formula | Sn42Bi57Ag0.4 |
| Form | Cartridge |
| Form Weight | 17.64 oz |
| Melting Point | 280 °F |
| Mesh Type | 4 |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 42 % |
| Storage/Refrigeration Temperature (Maximum) | 77 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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