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Description

General part information

R7FA4M3AF2CBQ#BC0

MCU:RA

Technical Specifications

Parameters and characteristics for this part

SpecificationR7FA4M3AF2CBQ#BC0
A/D Channels11 count
A/D Resolution (bits)12 bit
ConnectivityUART, QSPI, USB, SCI, USART, CANbus, SPI, I2C
Converter ArchitectureSAR
Core ProcessorARM® Cortex®-M33
Core Size (Bit Width)32 Bit
D/A Channels2 count
D/A Resolution (bits)12 bit
EEPROM Size (Depth)8 K
EEPROM Size (Width)8 bit
Mounting TypeSurface Mount
Number of I/O45
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package / Case64-LFBGA
Package Length6 mm
Package Name64-LFBGA
Package Width6 mm
PeripheralsCrypto - AES, WDT, DMA, LVD, PWM, Temp Sensor, POR, SHA, Capacitive Touch, RSA
Program Memory Depth1 M
Program Memory Size1 MB
Program Memory TypeFLASH
Program Memory Width8 bit
RAM Size Depth128 K
RAM Size Width8 bit
Speed100 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum2.7 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

    R7FA4M3AF2CBQ#BC0 | Renesas Electronics Corporation | Zenode.ai