SMDLTLFP10T5
ActiveChip Quik Inc.
SOLDER PASTE LOW TEMP LF T5 10CC
SMDLTLFP10T5
ActiveChip Quik Inc.
SOLDER PASTE LOW TEMP LF T5 10CC
Description
General part information
SMDLTLFP10T5
SOLDER PASTE LOW TEMP LF T5 10CC
Technical Specifications
Parameters and characteristics for this part
| Specification | SMDLTLFP10T5 |
|---|---|
| Ag Composition | 0.4 % |
| Bi Composition | 57.6 % |
| Composition Elements | Sn, Ag, Bi |
| Composition Formula | Bi57.6Sn42Ag0.4 |
| Form | Syringe |
| Form Volume | 10 cc |
| Form Weight | 1.23 oz |
| Melting Point | 281 °F |
| Mesh Type | 5 |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 42 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources