W97BH6KBQX2I

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Winbond Electronics

IC DRAM 2GBIT PARALLEL 168WFBGA

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Winbond Electronics

IC DRAM 2GBIT PARALLEL 168WFBGA

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	W97BH6KBQX2I	W97BH6 Series

Clock Frequency	400 MHz	400 - 533 MHz
Memory Format	DRAM	DRAM
Memory Interface	Parallel	HSUL_12, Parallel
Memory Organization	128 M	128 M
Memory Size	2 Gbit	2 Gbit
Memory Type	Volatile	Volatile
Mounting Type	Surface Mount	Surface Mount
Operating Temperature [Max]	85 °C	85 °C
Operating Temperature [Min]	-40 °C	-40 - -25 °C
Package / Case	168-WFBGA	134-VFBGA, 168-WFBGA
Supplier Device Package	168-WFBGA (12x12)	134-VFBGA, 168-WFBGA (12x12)
Supplier Device Package	-	10
Supplier Device Package	-	11.5
Technology	SDRAM - Mobile LPDDR2	SDRAM - Mobile LPDDR2-S4B, SDRAM - Mobile LPDDR2
Voltage - Supply [Max]	1.95 V	1.3 - 1.95 V
Voltage - Supply [Min]	1.14 V	1.14 - 1.7 V
Write Cycle Time - Word, Page	15 ns	15 ns

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

IC DRAM 2GBIT HSUL 12 134VFBGA

Part	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Package / Case	Memory Interface	Clock Frequency	Technology	Memory Type	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Size	Memory Organization	Memory Format	Supplier Device Package	Supplier Device Package [x]	Supplier Device Package [y]	Write Cycle Time - Word, Page
Winbond Electronics W97BH6MBVA1E TR	Surface Mount	-25 °C	85 °C	134-VFBGA	HSUL_12	533 MHz	SDRAM - Mobile LPDDR2-S4B	Volatile	1.14 V, 1.7 V	1.3 V, 1.95 V	2 Gbit	128 M	DRAM	134-VFBGA	10	11.5	15 ns
Winbond Electronics W97BH6KBQX2I	Surface Mount	-40 °C	85 °C	168-WFBGA	Parallel	400 MHz	SDRAM - Mobile LPDDR2	Volatile	1.14 V	1.95 V	2 Gbit	128 M	DRAM	168-WFBGA (12x12)			15 ns

General part information

SDRAM - Mobile LPDDR2 Memory IC 2Gbit Parallel 400 MHz 168-WFBGA (12x12)

Technical documentation and resources