
W25Q64CVSSSG
ActiveWinbond Electronics
IC FLASH 64MBIT SPI/QUAD 8SOIC
Deep-Dive with AI
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W25Q64CVSSSG
ActiveWinbond Electronics
IC FLASH 64MBIT SPI/QUAD 8SOIC
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | W25Q64CVSSSG | W25Q64 Series |
---|---|---|
- | - | |
Access Time | 6 ns | 6 - 7 ns |
Clock Frequency | 80 MHz | 80 - 133 MHz |
Memory Format | FLASH | FLASH |
Memory Interface | SPI - Quad I/O | SPI - Quad I/O, Quad I/O, QPI, SPI, DTR |
Memory Organization | 8M x 8 | 8M x 8 |
Memory Size | 64 Gbit | 64 Gbit |
Memory Type | Non-Volatile | Non-Volatile |
Mounting Type | Surface Mount | Surface Mount, Through Hole |
Operating Temperature [Max] | 125 °C | 85 - 125 °C |
Operating Temperature [Min] | -40 °C | -40 °C |
Package / Case | 8-SOIC | 24-TBGA, 8-WDFN Exposed Pad, 16-SOIC, 8-DIP, 8-SOIC, 8-XDFN Exposed Pad, 12-UFBGA, WLCSP, 16-UFBGA |
Package / Case | - | 0.3 in |
Package / Case | - | 7.62 mm |
Package / Case [x] | 0.209 " | 0.209 - 0.295 in |
Package / Case [y] | 5.3 mm | 5.3 - 7.5 mm |
Supplier Device Package | 8-SOIC | 24-TFBGA (8x6), 8-WSON (6x5), 16-SOIC, 8-PDIP, 8-WSON (8x6), 8-SOIC, 8-VSOP, 8-XSON (4x4), 12-WLCSP, 16-WLCSP |
Supplier Device Package | - | 2.31 - 2.47 |
Supplier Device Package | - | 2.03 - 3.12 |
Technology | FLASH - NOR | FLASH - NOR, FLASH - NOR (SLC) |
Voltage - Supply [Max] | 3.6 V | 1.95 - 3.6 V |
Voltage - Supply [Min] | 2.7 V | 1.65 - 2.7 V |
Write Cycle Time - Word, Page | - | 3 - 5 ms |
Write Cycle Time - Word, Page [custom] | 3 ms | 3 - 5 ms |
Write Cycle Time - Word, Page [custom] | 50 µs | 50 - 60 µs |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Distributor | Package | Quantity | $ | |
---|---|---|---|---|
W25Q64 Series
IC FLASH 64MBIT SPI/QUAD 24TFBGA
Part | Memory Organization | Clock Frequency | Memory Size | Memory Type | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Technology | Mounting Type | Supplier Device Package | Memory Interface | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Format | Package / Case [x] | Package / Case [y] | Package / Case | Package / Case | Access Time | Write Cycle Time - Word, Page | Supplier Device Package [x] | Supplier Device Package [y] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25Q64CVTBIG TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FVZPIQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64CVZPJG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FVSFIQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64FVDAIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-DIP | 3 ms | 50 µs | FLASH - NOR | Through Hole | 8-PDIP | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.3 in | 7.62 mm | ||||||
Winbond Electronics W25Q64CVZESG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64JVSFJQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64FVZPJQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FVSFIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64FVTCJQ TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVSFJQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64FVZPJQ TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVSFIQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64FVSSIF | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64JVTCIQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FVSTIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-VSOP | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64CVTBBG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64JWSSIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64JVXGJM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-XDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-XSON (4x4) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FWZPIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 5 ms | |||||||||
Winbond Electronics W25Q64FWSTIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-VSOP | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 5 ms | |||||||
Winbond Electronics W25Q64JWBYIM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 12-UFBGA, WLCSP | FLASH - NOR | Surface Mount | 12-WLCSP | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 3 ms | 2.31 | 2.03 | |||||||
Winbond Electronics W25Q64CVTBIP | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVZEIQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FVZEJQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVZPIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FWSFIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.295 in | 7.5 mm | 5 ms | |||||||
Winbond Electronics W25Q64FWWA | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 5 ms | 60 µs | FLASH - NOR | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 6 ns | ||||||||||
Winbond Electronics W25Q64FVSSAQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 7 ns | |||||
Winbond Electronics W25Q64FWSFIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.295 in | 7.5 mm | 5 ms | |||||||
Winbond Electronics W25Q64JWBYIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 12-UFBGA, WLCSP | FLASH - NOR | Surface Mount | 12-WLCSP | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 3 ms | 2.31 | 2.03 | |||||||
Winbond Electronics W25Q64JVSFIM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64JWZPIM | ||||||||||||||||||||||||
Winbond Electronics W25Q64FVTBAQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 7 ns | |||||||
Winbond Electronics W25Q64FWSSIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 5 ms | |||||||
Winbond Electronics W25Q64CVSFJG TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64FVZEBQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 7 ns | |||||||
Winbond Electronics W25Q64JVZEIM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FVTBIP | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVTBJQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 24-TBGA | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FWXGAQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-XDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-XSON (4x4) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64DWSFIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 1.7 V | 1.95 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64FVSSJQ TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64JWSSSQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | DTR, QPI, Quad I/O, SPI | 1.7 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 6 ns | 3 ms | ||||||
Winbond Electronics W25Q64FVZEAQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 7 ns | |||||||
Winbond Electronics W25Q64JVDAIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-DIP | FLASH - NOR | Through Hole | 8-PDIP | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.3 in | 7.62 mm | 3 ms | |||||||
Winbond Electronics W25Q64JVDAIQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-DIP | FLASH - NOR | Through Hole | 8-PDIP | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.3 in | 7.62 mm | 3 ms | |||||||
Winbond Electronics W25Q64BVSFIG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64CVZEJG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVSSAQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 6 ns | 3 ms | ||||||
Winbond Electronics W25Q64FWSSIQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 5 ms | |||||||
Winbond Electronics W25Q64DWSSIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.7 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64JWSSIN | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR (SLC) | Surface Mount | 8-SOIC | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 6 ns | 3 ms | ||||||
Winbond Electronics W25Q64NEXGIG TR | 8M x 8 | 64 Gbit | DTR, QPI, Quad I/O, SPI | FLASH | ||||||||||||||||||||
Winbond Electronics W25Q64FVTBJQ TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64CVSFIG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64JVTCJQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 24-TBGA | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64JWZPIQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64JVSSJQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64FWZEIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | ||||||||
Winbond Electronics W25Q64JVZPAQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | 3 ms | ||||||||
Winbond Electronics W25Q64FWSSAG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 6 ns | |||||
Winbond Electronics W25Q64JVZEJQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64CVTBAG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64JVSSAM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 6 ns | 3 ms | ||||||
Winbond Electronics W25Q64CVTBIG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FVSSJQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64FWSSIF TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64JVZEIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64JVTBJM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 24-TBGA | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64CVZPJG TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FWZPIQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | ||||||||
Winbond Electronics W25Q64FWSSAQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 6 ns | |||||
Winbond Electronics W25Q64JVSSJM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64JVSFJM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64CVSSBG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 6 ns | |||||
Winbond Electronics W25Q64CVZEIG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVSTIQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-VSOP | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64FVSFJQ TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64JVSSSM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 6 ns | 3 ms | ||||||
Winbond Electronics W25Q64FWXGIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-XDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-XSON (4x4) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | ||||||||
Winbond Electronics W25Q64JVZPJQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64JVSSJM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64FVZEIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64CVSSJG TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64FWSSBQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 6 ns | |||||
Winbond Electronics W25Q64BVZEIG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64DWZEIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | QPI, Quad I/O, SPI | 1.7 V | 1.95 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FWZPSQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 8-WDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64FVSFBQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 7 ns | |||||
Winbond Electronics W25Q64JVDAIM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-DIP | FLASH - NOR | Through Hole | 8-PDIP | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.3 in | 7.62 mm | 3 ms | |||||||
Winbond Electronics W25Q64JVZPIM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | 3 ms | ||||||||
Winbond Electronics W25Q64CVSSJP | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64JVZPJQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64CVZEJP TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64CVZEJP | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FWSTIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-VSOP | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 5 ms | |||||||
Winbond Electronics W25Q64JVXGIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-XDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-XSON (4x4) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | 3 ms | ||||||||
Winbond Electronics W25Q64CVSFBG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 6 ns | |||||
Winbond Electronics W25Q64FVSSJF TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64FWSSSQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 8-SOIC | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 6 ns | |||||
Winbond Electronics W25Q64FVTBIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JWSSIM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64CVZPJP TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FVDAIQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-DIP | 3 ms | 50 µs | FLASH - NOR | Through Hole | 8-PDIP | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.3 in | 7.62 mm | ||||||
Winbond Electronics W25Q64FVSFJQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64FVSSIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64FWZPIF | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | ||||||||
Winbond Electronics W25Q64CVSFJP | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64FVTCIF | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JWZPIQ | ||||||||||||||||||||||||
Winbond Electronics W25Q64JVSTIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-VSOP | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64JVSSIQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64CVSSIG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64FWZPSG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 8-WDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64CVSSSG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 6 ns | |||||
Winbond Electronics W25Q64CVZPSG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64FVSSIQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64FWBYIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-UFBGA, WLCSP | FLASH - NOR | Surface Mount | 16-WLCSP | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 5 ms | 2.47 | 3.12 | |||||||
Winbond Electronics W25Q64JVBYIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 12-UFBGA, WLCSP | FLASH - NOR (SLC) | Surface Mount | 12-WLCSP | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 6 ns | 3 ms | ||||||||
Winbond Electronics W25Q64JVZEIM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64JVTBSQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 24-TBGA | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | 3 ms | ||||||||
Winbond Electronics W25Q64JWZPIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FVSSIP | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64DWZPIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.7 V | 1.95 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FWSSIQ TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 5 ms | |||||||
Winbond Electronics W25Q64FVSSJF | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64FVSSIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64CVTBIP TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FVTBJQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVSSIM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64JVSSJQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64JVSFIM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64FVSSBQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 7 ns | |||||
Winbond Electronics W25Q64CVSSJG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64FVXGJQ TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-XDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-XSON (4x4) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FVZPIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JWZPAQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | DTR, QPI, Quad I/O, SPI | 1.7 V | 1.95 V | FLASH | 6 ns | 3 ms | ||||||||
Winbond Electronics W25Q64CVZEAG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64FVZPBQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 7 ns | |||||||
Winbond Electronics W25Q64JVZEJM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FVXGJQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-XDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-XSON (4x4) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FVSFAQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 7 ns | |||||
Winbond Electronics W25Q64JWSSIM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64CVZPJP | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64CVWS | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 3 ms | 50 µs | FLASH - NOR | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | ||||||||||
Winbond Electronics W25Q64FVSFIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64JVZEAQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | 3 ms | ||||||||
Winbond Electronics W25Q64JWSSIQ TR | ||||||||||||||||||||||||
Winbond Electronics W25Q64JVSSIM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64FVZPIF | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVZPJM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64JWZPIM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FWSSIF | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64JVSSSQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 6 ns | 3 ms | ||||||
Winbond Electronics W25Q64JWSSIQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64JWXGIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-XDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-XSON (4x4) | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64JVXGJM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-XDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-XSON (4x4) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64CVTBSG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64JVSTIM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-VSOP | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64JWXGIM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-XDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-XSON (4x4) | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64FVTBBQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 7 ns | |||||||
Winbond Electronics W25Q64JWBYIM TR | ||||||||||||||||||||||||
Winbond Electronics W25Q64FWSSIG | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 0.209 " | 5.3 mm | 5 ms | |||||||
Winbond Electronics W25Q64JVSSIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64FWZPIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 5 ms | |||||||||
Winbond Electronics W25Q64JVSFSM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 6 ns | 3 ms | ||||||
Winbond Electronics W25Q64CVZEJG TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64JVZPJM | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64CVSFJP TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64FWSSIG | ||||||||||||||||||||||||
Winbond Electronics W25Q64FWZPBQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64BVSSIG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-SOIC | FLASH - NOR | Surface Mount | 8-SOIC | SPI | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | 3 ms | |||||||
Winbond Electronics W25Q64JVSFJM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64JVXGJQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-XDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-XSON (4x4) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64CVWSP1 | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 3 ms | 50 µs | FLASH - NOR | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 6 ns | ||||||||||
Winbond Electronics W25Q64FWZPIF TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | ||||||||
Winbond Electronics W25Q64FVZPAQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 7 ns | |||||||
Winbond Electronics W25Q64CVSFAG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 6 ns | |||||
Winbond Electronics W25Q64FVWB | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 3 ms | 50 µs | FLASH - NOR | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | 7 ns | ||||||||||||
Winbond Electronics W25Q64JVSFIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 16-SOIC | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 3 ms | |||||||
Winbond Electronics W25Q64CVSSJP TR | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.209 " | 5.3 mm | ||||||
Winbond Electronics W25Q64FWZPAQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 8-WDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 6 ns | |||||||
Winbond Electronics W25Q64JWZEIQ | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (8x6) | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64JVTCIQ TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 24-TBGA | FLASH - NOR | Surface Mount | 24-TFBGA (8x6) | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64JWZPIM TR | 8M x 8 | 133 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | FLASH - NOR | Surface Mount | 8-WSON (6x5) | SPI - Quad I/O | 1.7 V | 1.95 V | FLASH | 3 ms | |||||||||
Winbond Electronics W25Q64CVSFSG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 125 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | 6 ns | |||||
Winbond Electronics W25Q64FVZPIG TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 2.7 V | 3.6 V | FLASH | ||||||||
Winbond Electronics W25Q64FWZPIQ TR | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-WDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-WSON (6x5) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | ||||||||
Winbond Electronics W25Q64CVSFJG | 8M x 8 | 80 MHz | 64 Gbit | Non-Volatile | 105 °C | -40 °C | 16-SOIC | 3 ms | 50 µs | FLASH - NOR | Surface Mount | 16-SOIC | SPI - Quad I/O | 2.7 V | 3.6 V | FLASH | 0.295 in | 7.5 mm | ||||||
Winbond Electronics W25Q64FWXGBQ | 8M x 8 | 104 MHz | 64 Gbit | Non-Volatile | 85 °C | -40 °C | 8-XDFN Exposed Pad | 5 ms | 60 µs | FLASH - NOR | Surface Mount | 8-XSON (4x4) | QPI, Quad I/O, SPI | 1.65 V | 1.95 V | FLASH | 6 ns |
Description
General part information
W25Q64 Series
FLASH - NOR Memory IC 64Mbit SPI - Quad I/O 80 MHz 6 ns 8-SOIC
Documents
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