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Description

General part information

CB028D0393J--

FILM CHIP

Technical Specifications

Parameters and characteristics for this part

SpecificationCB028D0393J--
ApplicationsGeneral Purpose
Capacitance0.039 µF
Dielectric MaterialPolyphenylene Sulfide (PPS), Metallized - Stacked
FeaturesLow ESL, Low ESR
Height - Seated (Max)0.083 in
Mounting TypeSurface Mount
Operating Temperature (Max)125 °C
Operating Temperature (Min)-55 °C
Package / Case1210 (3225 Metric)
Size / Dimension Length0.13 in
Size / Dimension Width0.098 in
TerminationSolder Pads
Tolerance5 %
Voltage Rating - AC40 V
Voltage Rating - DC50 V

Pricing

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CAD

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