WS991LT500T4C
ActiveChip Quik Inc.
THERMALLY STABLE SOLDER PASTE WS
WS991LT500T4C
ActiveChip Quik Inc.
THERMALLY STABLE SOLDER PASTE WS
Description
General part information
WS991LT500T4C
THERMALLY STABLE SOLDER PASTE WS
Technical Specifications
Parameters and characteristics for this part
| Specification | WS991LT500T4C |
|---|---|
| Ag Composition | 0.4 % |
| Bi Composition | 57.6 % |
| Composition Elements | Sn, Bi, Ag |
| Composition Formula | Sn42Bi57.6Ag0.4 |
| Flux Type | Water Soluble |
| Form | Cartridge |
| Form Weight | 17.64 oz |
| Melting Point | 280 °F |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 42 % |
| Storage/Refrigeration Temperature (Maximum) | 77 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources