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0C97056002

0C97056002

Active
Laird Technologies EMI

RFI FINGERSTOCK BECU UNPLAT ADH

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0C97056002

0C97056002

Active
Laird Technologies EMI

RFI FINGERSTOCK BECU UNPLAT ADH

Find alt

Description

General part information

0C97056002

RFI FINGERSTOCK BECU UNPLAT ADH

Technical Specifications

Parameters and characteristics for this part

Specification0C97056002
Attachment MethodAdhesive
Height0.12 in
Length24 in
MaterialBeryllium Copper
Operating Temperature121 °C
PlatingUnplated
TypeFingerstock
Width12.7 mm

Pricing

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CAD

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Documents

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