RMA591LT250
ActiveChip Quik Inc.
RMA SOLDER PASTE SN42/BI57.6/AG0
RMA591LT250
ActiveChip Quik Inc.
RMA SOLDER PASTE SN42/BI57.6/AG0
Description
General part information
RMA591LT250
No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4) Jar, 8.8 oz (250g)
Technical Specifications
Parameters and characteristics for this part
| Specification | RMA591LT250 |
|---|---|
| Ag Composition | 0.4 % |
| Bi Composition | 57.6 % |
| Composition Elements | Sn, Bi, Ag |
| Composition Formula | Sn42Bi57.6Ag0.4 |
| Form | Jar |
| Form Weight | 8.8 oz |
| Melting Point | 280 °F |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 42 % |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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