OM13496UL
ActiveBREAKOUT BOARD, 16-XQFN, 16-XFBGA, 28-TSSOP, 16-QSOP/DIP, 0.1" PITCH SPACING
OM13496UL
ActiveBREAKOUT BOARD, 16-XQFN, 16-XFBGA, 28-TSSOP, 16-QSOP/DIP, 0.1" PITCH SPACING
Description
General part information
OM13496UL
OM13496UL is a surface mount to DIP evaluation board. The OM13496 allows one to evaluate small, surface mount devices by breaking out the package leads to 100mil centers pins, emulating a DIP package. The OM13496 supports the following packages such as QSOP16 (SOT519-1), XFBGA16 (SOT1354-1), XQFN16 (SOT1161-1), TSSOP28 (SOT361-1).
Technical Specifications
Parameters and characteristics for this part
| Specification | OM13496UL |
|---|---|
| Kit Type | Adapter, Breakout Boards |
| Number of Positions | 16, 28 |
| Package Accepted | XFBGA, XQFN, QSOP, TSSOP28 |
| Quantity | 23 pcs |
| Quantity Details | 4 Values, Mixed Quantities |
| Specifications | SMD to DIP |
Pricing
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CAD
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Documents
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