SMDLTLFP50T6
ActiveChip Quik Inc.
SOLDER PASTE IN JAR 50G (T6) SN4
SMDLTLFP50T6
ActiveChip Quik Inc.
SOLDER PASTE IN JAR 50G (T6) SN4
Description
General part information
SMDLTLFP50T6
SOLDER PASTE IN JAR 50G (T6) SN4
Technical Specifications
Parameters and characteristics for this part
| Specification | SMDLTLFP50T6 |
|---|---|
| Ag Composition | 0.4 % |
| Bi Composition | 57.6 % |
| Composition Elements | Sn, Bi, Ag |
| Composition Formula | Sn42Bi57.6Ag0.4 |
| Form | Jar |
| Form Weight | 1.76 oz |
| Melting Point | 280 °F |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 42 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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