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PG-HSOF-8-1

IMT65R057M1HXUMA1

NRND
INFINEON

THE 650V COOLSIC™ IN TOLL LEVERAGES THE STRENGTHS OF THE INFINEON SIC TECHNOLOGY TO ENABLE HIGHER DENSITY DESIGNS AND HIGHER SWITCHING FREQUENCY OPERATIONS.

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PG-HSOF-8-1

IMT65R057M1HXUMA1

NRND
INFINEON

THE 650V COOLSIC™ IN TOLL LEVERAGES THE STRENGTHS OF THE INFINEON SIC TECHNOLOGY TO ENABLE HIGHER DENSITY DESIGNS AND HIGHER SWITCHING FREQUENCY OPERATIONS.

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Description

General part information

IMT65R057M1HXUMA1

CoolSIC™ MOSFET650 V, 57 mΩ in TOLL package leverages the strengths of the Infineon SiC technology to enable higher density designs and higher switching frequency operations. The small form factor and low parasitic of TOLL allow for an efficient and effective usage of board space as well to drive the MOSFET at higher frequencies, reaching higher power density. CoolSIC™ MOSFET 650 V, 57 mΩ in TOLL package offering is complemented by the availability of TOLL also forCoolMOS™andCoolGaN™, making it an appealing one stop shop option for various systems. The reduction of thermal impedance compared to D²PAK, together with the innovative .XT interconnect, make the 57 mΩ product suitable for high to mid power systems, with high efficiency targets. It ideally fits the emerging Totem Pole PFC topology in high to mid power systems. It also enables high efficiency and density in DC-DC and AC-DC stages of high to mid power systems. It is also successfully used in interleaved topologies to address high efficiency targets in high power systems.

Technical Specifications

Parameters and characteristics for this part

SpecificationIMT65R057M1HXUMA1
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)18 V
Mounting TypeSurface Mount
Package / Case8-PowerSFN
Package NamePG-HSOF-8-2
TechnologySiCFET (Silicon Carbide)

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